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界面应力是判断界面失效的关键参数,因此准确地预测界面应力对多层电子器件的设计具有重要意义.多层电子器件的层间界面处会出现较大的应力集中,引起结构发生塑性变形,而塑性区域的存在会改变应力集中程度,影响界面应力的分布,几何非线性和材料塑性的联合作用又会导致界面应力呈现不一样的奇异性.本文综合考虑弹塑性变形和几何非线性,对多层电子器件的界面应力分布及塑性区域发展进行了分析.以三层电子器件为例,详细讨论了电子器件在角位移加载和线位移加载两种模式下,界面应力分布和塑性区域的发展规律.相关结论可用于改善多层电子器件的工业设计.
Interfacial stress is the key parameter to judge the interface failure, so accurately predict the interfacial stress is of great significance to the design of multi-layer electronic devices.Multi-layer electronic devices will appear larger stress concentration at the interface between layers, causing the structure to undergo plastic deformation, The existence of plastic region will change the concentration of stress and affect the distribution of interface stress, and the combined effect of geometrical nonlinearity and material plasticity will lead to the different singularity of interface stress.In this paper, considering the elastic-plastic deformation and geometric nonlinearity, The interfacial stress distribution and the development of plastic zone in multi-layer electronic devices are analyzed.With the three-layer electronic devices as an example, the interface stress distribution and the development of plastic regions are discussed in detail under the two modes of angular displacement loading and linear displacement loading The results can be used to improve the industrial design of multilayer electronic devices.