随着工业和科学技术的发展,在电镀技术中,对电镀层的质量提出了越来越高的要求,尤其是对电镀层厚度的均匀性的要求,越来越严格。影响电镀层厚度均匀性的主要因素,可以归结为两个方面,一是电镀液的性质及电镀规范,二是几何因素(镀槽中阴极和阳极的形状及位置等)的影响。通过改变电镀液的性质,选择适当的络合物与添加剂,是获得均匀镀层的重要途径。但是,只靠改变电镀液性质来获得均匀镀层,受到一定的限制。在分散能力较低的电镀液中,几何因素的影响非常突出,电镀工作者在长期研究和实践中创造的象形阳极法和保护阴极 With the development of industry and science and technology, in electroplating technology, the quality of electroplating has been put forward higher and higher requirements, especially the uniformity of electroplating thickness requirements, more stringent. The main factors affecting the uniformity of plating thickness, can be attributed to two aspects, one is the nature of the plating bath and plating norms, the second is the geometric factors (plating tank cathode and anode shape and location, etc.). By changing the nature of electroplating solution, select the appropriate complexes and additives, is an important way to obtain uniform coating. However, only by changing the nature of the bath to obtain a uniform coating, subject to certain restrictions. In the dispersion capacity of the lower electroplating solution, the impact of geometric factors are very prominent, electroplating workers in the long-term research and practice to create a pictographic anode method and cathodic protection