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针对印刷CNT薄膜中CNT与衬底的不良接触对发光稳定性的影响,提出了一种可改善器件发光稳定性的阴极共烧结制造工艺.通过对银浆印刷层和CNT印刷层采用的共烧结处理,在CNT和银导电衬底接触部位可形成几何匹配或产生CNT镶嵌于银层的结构,在薄膜顶部则形成CNT团聚物与银块互相嵌套的结构.这些结构使CNT与银导电层的接触面积增加,形成欧姆接触的可能性大大提高,从而使采用共烧结阴极制造的器件在高亮度下的发光稳定性及寿命较采用普通阴极的器件提高5.6倍.
Aiming at the adverse effect of poor contact between CNT and substrate on the luminescent stability in printed CNT film, a cathode co-sintering process was proposed to improve the light-emitting stability of the device.Through the co-sintering Treatment, the CNT and silver conductive substrate contact parts can form a geometric matching or produce CNT embedded in the silver layer structure, the top of the film is formed CNT agglomeration and silver ingot nested structure of these structures so that CNT and silver conductive layer Increases the contact area and greatly increases the possibility of forming ohmic contact, so that the device manufactured by using a co-sintered cathode has a luminescent stability and a life expectancy of 5.6 times higher than that of an ordinary cathode device under high brightness.