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热冲击下红外焦平面探测器的高碎裂概率制约着其成品率.为明晰碎裂机理,基于等效设想,利用小面阵等效大面阵解决了128×128面阵探测器三维结构建模所需单元数过多的问题,同时综合考虑材料线膨胀系数的温度依赖性、材料强度的各向异性、表面加工损伤效应,合理选取InSb材料性能参数,建立起128×128面阵探测器结构有限元分析模型.模拟结果表明:热冲击下最大Von Mises应力值出现在N电极区域,其极值呈非连续分布,这意味着热冲击下128×128面阵探测器的裂纹起源于N电极区域,且不止一条.上述结论与碎裂统计分析报告中典型裂纹起源地及裂纹分布这两方面相符合,这为后续面阵探测器碎裂诱因的研究及结构可靠性设计提供了切实可行的研究思路.
The high fragmentation probability of the infrared focal plane detector under thermal shocks restricts its yield. To clarify the mechanism of fragmentation, based on the equivalent assumption, the three-dimensional structure of 128 × 128 array detector In the meantime, the temperature dependence of linear thermal expansion coefficient, the anisotropy of material strength and the damage effect of surface treatment are considered comprehensively, and the performance parameters of InSb material are reasonably selected to establish 128 × 128 surface array sounding The finite element analysis model of the structure of the detector is established.The simulation results show that the maximum Von Mises stress value under thermal shock appears in the N electrode area and its extreme value is discontinuous distribution, which means that the crack of 128 × 128 array detector under thermal shock originates from N electrode area, and more than one.The above conclusions coincide with both the origin of the typical cracks and the distribution of the cracks in the statistical report of the fragmentation, which provides a solid foundation for the research and structural reliability design of the subsequent area array detector Feasible research ideas.