本文对小腔体胶接密封技术,提出了等压加热固化工艺。并在半导体光电器件的密封技术上得到了应用。它具有固化周期短、粘封致密、消除了漏孔、强度高等特点。半导体光电器件,如探测器件、光源器件、电荷耦合器件均有光学窗口。窗口一般用光学玻璃或兰宝石、Si、Ge之类的红外材 In this paper, small cavity adhesive bonding technology, put forward the isothermal curing process. And in the semiconductor optoelectronic devices sealing technology has been applied. It has a short curing cycle, sealing dense, eliminating the leak holes, high strength and so on. Semiconductor optoelectronic devices, such as detection devices, light source devices, charge-coupled devices have optical windows. Window with optical glass or sapphire, Si, Ge and the like infrared material