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对用压力铸造法制造的碳化硅颗粒增强铝合金（ＳｉＣｐ／Ａｌ）复合材料的微观结构和界面进行了研究。结果表明：碳化硅颗粒在复合材料中均匀分布，复合材料的基体中有较高的位错密度，碳化硅颗粒中有少量的层错。研究还发现ＳｉＣｐ／Ａｌ复合材料中界面结合良好，没有反应物生成，并且在界面处没有发现孔隙存在。在复合材料拉伸断口上没有发现裸露的碳化硅颗粒，说明在复合材料拉伸破坏时ＳｉＣｐ－Ａｌ界面没有开裂，反映了压铸ＳｉＣｐ／Ａｌ复合材料中良好的界面结合。
The microstructure and interface of SiCp / Al composites fabricated by pressure casting method were studied. The results show that the silicon carbide particles are uniformly distributed in the composite material, the matrix of the composite material has a higher dislocation density and a small amount of layer faults in the silicon carbide particles. The study also found that SiCp / Al composites with good interfacial adhesion, no reactants, and no pores were found at the interface. No bare silicon carbide particles were found on the tensile fracture of the composite, indicating that the SiCp-Al interface did not crack when tensile fracture of the composite material, which reflected the good interfacial bonding in the die-cast SiCp / Al composite.