针对长线阵12000元CCD封装密封技术进行了探讨,比较了目前封装中的几种主流封盖技术的特点,表明采用胶封技术在目前对CCD来说是一种合理选择。针对紫外胶A,进行了胶封工艺的开发。对氟油粗检漏技术进行了分析,最终采用了一种新的氦气加压常温气泡检漏法对器件的密封效果进行考核检测。 Aiming at the 12000 yuan CCD package sealing technology of long line array, the characteristics of several mainstream capping technologies in current packaging are compared, which shows that the use of glue sealing technology is a reasonable choice for CCD at present. For UV glue A, the rubber sealing process was developed. The crude oil leak detection technology was analyzed, and finally a new helium pressurized atmospheric bubble leak detection method was used to check the sealing effect of the device.