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通孔消失是困扰半导体生产的难点之一.它与产品的生产合格率息息相关,正因为如此这一问题一直摆在业界工程师面前.由于这一问题的成因较多,故在分析和解决问题上存在诸多困扰.本文实验并分析了多种通孔消失的实效模型,结合先进的缺陷测试手段对其给出了不同的解决方案.此外,对相应的光刻胶也进行了研究并将缺陷密度与光刻胶的分辨率相联系,通过研究发现较低的分辨率的光刻胶的缺陷密度也相应较低.
The disappearance of vias is one of the difficulties that plagued the semiconductor production.It is closely related to the passing rate of the production of the products, because of this problem has been placed in front of industry engineers.As the causes of this problem more, so in the analysis and problem solving There are many troubles.This paper experiments and analyzes the effectiveness of a variety of vias disappear model, combined with advanced defect testing methods to give its different solutions.In addition, the corresponding photoresist has also been studied and the defect density Associated with the resolution of the photoresist, it has been found through research that the resist density of the lower resolution photoresist is correspondingly lower.