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再流焊就是把集成电路、有源和无源元件采用无引线结构形式,使之微型、片状化,直接平贴焊在印制板上。采用非接触焊接,效率高,焊接可靠,外观整洁、美观,尤其适合电子产品的高密度、微型化组装。与传统的手工焊、波峰焊相比,再流焊大大提高了组装密度;提高了电子设备的性能和焊接可靠性;提高了生产效率,本文就再流焊的概况、设备和工作原理,工艺过程以及实践效果作一慨要介绍。
Reflow soldering is the integrated circuit, active and passive components with lead-free structure, so that the micro, flake, flat and direct welding on the PCB. Non-contact welding, high efficiency, reliable welding, clean appearance, beautiful, especially for high density electronic products, miniaturization assembly. Compared with the traditional manual welding, wave soldering, reflow soldering greatly enhance the assembly density; improve the performance of electronic equipment and welding reliability; improve the production efficiency, this article reflow profile, equipment and working principle, technology Process and practical effect for a generous to be introduced.