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用动电位伏安法对纯铜电极、纯钴电极以及含钴量 5 1%、9 7%、15 %、2 5 %和 40 %的铜钴合金电极在硼砂—硼酸缓冲溶液 (pH8 5 )中的光电化学行为进行了研究。纯铜电极、纯钴电极和铜钴合金电极均显示P 型光响应 ,纯铜电极的光响应来自Cu2 O ,纯钴电极的光响应主要来自Co3O4 ,铜钴合金电极的光响应来自Cu2 O和Co3O4 的共同作用。纯铜电极在阳极氧化过程中存在着Cu的阳极溶解和电极表面生成Cu2 O膜的反应 ,温度升高有利于Cu2 O膜的生成 ,除氧与否影响纯铜电极的成膜反应。纯钴电极电位正向扫描时不显示光响应 ,负向扫描时显示阴极光电流。铜钴合金电极的光响应随含钴量而变化。
The potentiodynamic voltammetry was used to investigate the electrochemical behaviors of pure copper electrode, pure cobalt electrode and copper-cobalt alloy electrode with 5 1%, 97%, 15%, 25% and 40% cobalt content in borax-borate buffer solution (pH8 5) In the photoelectrochemical behavior of the study. Pure copper electrode, pure cobalt electrode and copper-cobalt alloy electrode showed P-type photoresponse, pure copper electrode photoresponse from Cu2O, pure cobalt electrode photoresponse mainly from Co3O4, copper-cobalt alloy electrode photoresponse from Cu2O and Co3O4 synergy. Pure copper electrode in the anodic oxidation process there is anodic dissolution of Cu electrode surface and the formation of Cu2 O film reaction, the temperature is conducive to the formation of Cu2 O film, deoxidation or not affect the pure copper electrode film forming reaction. Pure cobalt electrode potential forward scan does not show the light response, the negative scan cathode current display. The photoresponse of copper-cobalt alloy electrode varies with cobalt content.