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在酚醛树脂中分别加入不同质量分数的氧化石墨粉、化学还原氧化石墨烯乙醇悬浮液及热法还原石墨烯粉,采用溶液共混法和热压成型法制备氧化石墨烯/酚醛树脂、还原氧化石墨烯/酚醛树脂、石墨烯/酚醛树脂复合材料,然后在氩气气氛中经1 700,2 000,3 000℃高温热处理。结果表明,这3种填料大部分以剥离单片/少层形态均匀分散于树脂基体中,其表面粗糙,可提高界面结合强度和耐热性;在低于2 000℃下,3种填料的加入能有效减小树脂基体的层间距,且高含量氧化石墨粉效果最明显。同时结合微晶生长及催化理论,提出氧化石墨烯等对树脂层间距减小的作用机理。
In the phenolic resin were added in different mass fractions of graphite oxide, chemically reduced graphene oxide suspension and thermal reduction of graphene powder, prepared by solution blending and hot pressing of graphene oxide / phenolic resin, reduction and oxidation Graphene / phenolic resin, graphene / phenolic resin composites, and then heat treated in an argon atmosphere at a high temperature of 1 700, 2 000 and 3 000 ° C. The results showed that most of the three fillers were uniformly dispersed in the resin matrix with peeled monolithic / lamellar morphology, and the surface roughness of the three fillers could improve the interfacial bonding strength and heat resistance. At below 2 000 ℃, the three fillers Join can effectively reduce the resin matrix layer spacing, and the high content of graphite oxide powder the most obvious effect. At the same time, combined with the theory of microcrystal growth and catalysis, the mechanism of decreasing the spacing of the resin layer by graphene oxide was proposed.