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发光二极管(LED)能将电能高效转化为光能,在照明领域的应用得到了迅速发展,对LED封装材料的要求也越来越高。普通环氧树脂在耐紫外辐射、耐热老化性能方面的缺陷限制了其作为封装材料的发展;有机硅的“杂化分子”结构使材料有稳定的光学性能、可调的力学性能和优异的整体性能,因此有机硅材料在LED封装领域发展前景广阔,吸引了越来越多科研人员的关注。另外,为满足不断发展的LED封装的要求,需要对有机硅进行改性。
Light-emitting diode (LED) can be highly efficient conversion of electrical energy into light, the rapid development in the field of lighting applications, LED packaging materials are also increasingly demanding. Ordinary epoxy resin in ultraviolet radiation resistance, heat aging properties of the defect limits its development as a packaging material; silicone “hybrid” The structure of the material has a stable optical properties, adjustable mechanical properties and Excellent overall performance, so the development of silicone materials in the field of LED packaging has broad prospects, attracting more and more researchers attention. In addition, to meet the evolving LED packaging requirements, the need for silicone modification.