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介绍了一种基于硅体加工技术以及阳极键合技术的微热管阵列。通过两种传热模型对微热管的性能进行了分析。利用传统热管理论及经典传热理论对传热性能进行定量计算,将传热过程逐步分解并建立传热模型,对热管热阻进行估算。这种较简易的分析模型可为热管设计提供初步的参考结果。再利用有限元法以同样的参数来模拟热管传热过程以得到更加精确的热阻及热场分布结果,采用An-sys软件来进行有限元的分析。
A micro-heat pipe array based on silicon processing technology and anodic bonding technology is introduced. The performance of the micro-heat pipe is analyzed by two heat transfer models. The traditional heat pipe theory and classical heat transfer theory are used to quantitatively calculate the heat transfer performance. The heat transfer process is gradually decomposed and the heat transfer model is established to estimate the thermal resistance of the heat pipe. This simpler analytical model can provide initial reference for heat pipe design. Re-use finite element method to simulate the heat pipe heat transfer process with the same parameters to get more accurate thermal resistance and thermal field distribution results, the use of An-sys software for finite element analysis.