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本文研究了银的不同配体配合物与N_2H_4的反应体系,获得微量铜(Ⅱ)离子的加入,不仅能有效地加快反应速度,提高银的还原沉析率,还获得银的还原沉析率随银配合物稳定常数的增大而降低的结果.
In this paper, the reaction system of different ligand complexes of silver with N 2 H 4 was studied. The addition of trace copper (Ⅱ) ions can not only accelerate the reaction speed and increase the reduction and deposition rate of silver, but also reduce and precipitate the silver With the silver complex stability constant increases with the decrease of the results.