最近在混合集成电路等组装中,大多把裸片直粘接在基板上。。在这种情况下,不能采用过去粉状树脂的传送模,希望采用液状环氧树脂进行密封。另外,最近的集成电路超薄型封装也能采用液状环氧树脂。为此,东芝电气公司开发了CT414P产品,重视了对基板的粘附性、元件的低应力性和作业性。 Recently, in the assembly of a hybrid integrated circuit, most of the bare chips are bonded directly to a substrate. . In this case, it is not possible to use a transfer mold of past pasty resin, and it is desirable to use a liquid epoxy resin for sealing. In addition, liquid epoxy resins can also be used in the recent ultra-thin package of integrated circuits. To this end, Toshiba Electric Company developed the CT414P product, attaching importance to adhesion to substrates, low stress and workability of components.