“第二届全国半导体、后封装设备、模具技术交流会”于 2 0 0 2年 9月 1 0日～ 1 2日在无锡华晶宾馆举行。本次会议由中国电子专用设备工业协会和中国半导体行业协会集成电路专业协会共同举办。大会主席中国电子专用设备工业协会金存忠秘书长和中国半导体行业协会集成电路专业 The Second National Seminar on Semiconductor, Post-packaging Equipment and Mold Technology was held at Huajing Hotel in Wuxi from September 10 to January 12, 2002. This meeting is jointly organized by China Electronic Special Equipment Industry Association and China Semiconductor Industry Association Integrated Circuit Professional Association. Chairman of the General Assembly China Electronic Equipment Industry Association Jincunzhong Secretary General and China Semiconductor Industry Association of integrated circuit professional