水射流导引激光钻孔传热分析及数值模拟

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水射流导引激光加工是一种新型的加工技术,结合了激光加工和水射流加工的优点,其中高速微水射流像“液体光纤”一样来导引激光束,具有更加优异的加工性能,更高的加工精度和质量。将钻孔过程分为三个阶段,基于有限体积法建立了水射流导引激光束对硅工件进行钻孔的传热模型,模拟了水射流导引激光钻孔过程中的热量传递,相变过程和动边界的传递过程。结果表明:工件上最高温度出现在壁面以下区域;射流在激光加工中有强冷却作用,明显减小了热影响区。 Water jet guided laser processing is a new type of processing technology that combines the advantages of laser processing and water jet processing, where high speed micro water jet directs the laser beam as a “liquid fiber” with superior processability , Higher processing precision and quality. The drilling process is divided into three stages. Based on the finite volume method, a heat transfer model of water jet guided laser beam for drilling silicon workpieces is established. The heat transfer during the laser drilling of water jet is simulated. Process and moving boundaries of the transfer process. The results show that the maximum temperature of the workpiece appears in the area below the wall. The jet has a strong cooling effect in the laser processing, which obviously reduces the HAZ.
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