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镍电镀液含镍量高,其浓度比其他离子的浓度大10～100倍,因而有利于寻找对镍的简单的光度分析法。一般电镀液中镍的测定用EDTA滴定法。Kure a等以水化离子的形式直接测定合金中的镍,摩尔吸光率约12,但未研究硫酸根和氯离子的影响。我们根据电镀液成份的特点,研究了用流动注射-吸光光度法直接测定电镀液中的水化镍离子,得到满意结果。采样速度达240样·h~(-1)。
Nickel plating solution contains high nickel content, the concentration of 10 ~ 100 times larger than other ions, which is conducive to finding a simple spectrophotometric method for nickel. The general determination of nickel plating solution with EDTA titration. Kurea et al. Directly measured the nickel in the alloy as hydrated ions with an approximate molar absorptivity of about 12 but did not study the effect of sulfate and chloride. According to the characteristics of electroplating solution, we studied the direct determination of nickel hydride in electroplating solution by flow injection - absorption spectrophotometry, and obtained satisfactory results. Sampling speed of 240 samples · h ~ (-1).