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离子束溅射技术是制备Ta2O5薄膜的重要技术之一。采用正交试验设计方法,系统研究了Ta2O5薄膜的折射率、折射率非均匀性、消光系数、沉积速率和应力与工艺参数(基板温度、离子束压、离子束流和氧气流量)之间的关联性。通过使用分光光度计和椭圆偏振仪测量Ta2O5薄膜透过率光谱和反射椭偏特性,再利用全光谱反演计算的方法获得薄膜的折射率、折射率非均匀性、消光系数和物理厚度。Ta2O5薄膜的应力通过测量基底镀膜前后的表面变形量计算得到。实验结果表明:基板温度是影响Ta2O5薄膜特性的共性关键要素,其他工艺参数的选择与需求的薄膜特性相关。研究结果对于制备不同应用的Ta2O5薄膜制备工艺参数选择具有指导意义。
Ion beam sputtering technology is one of the important techniques for preparing Ta2O5 thin films. The orthogonal experimental design method was used to systematically study the relationship among refractive index, refractive index inhomogeneity, extinction coefficient, deposition rate and stress of Ta2O5 films and process parameters (substrate temperature, ion beam pressure, ion beam current and oxygen flow rate) Relevance. The refractive index, refractive index inhomogeneity, extinction coefficient and physical thickness of Ta 2 O 5 thin film were measured by using full spectrum inversion method by using spectrophotometer and ellipsometer. The stress of the Ta2O5 thin film is calculated by measuring the amount of surface deformation before and after the base coating. The experimental results show that the substrate temperature is a common key factor affecting the properties of Ta2O5 films. The selection of other process parameters is related to the required film characteristics. The research results are instructive for the selection of process parameters for preparing Ta2O5 thin films with different applications.