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异质集成技术是微系统的核心技术,分为混合异质集成技术和单片异质集成技术。单片异质集成技术因具有较高的集成度,逐渐成为研究热点。从两个方面介绍了微系统中单片异质集成技术的研究现状和进展。在微电子器件方面,主要发展方向为Ⅲ-Ⅴ族和Si基CMOS电子器件的单片异质集成;在光电子、MEMS器件方面,主要发展方向为Ⅲ-Ⅴ族光电器件、Si基CMOS电子器件和MEMS器件等的单片异质集成。最后,总结出异质集成技术面临的挑战和丞待解决的问题。
Heterogeneous integration technology is the core technology of micro-system, which is divided into hybrid heterogeneous integration technology and monolithic heterogeneous integration technology. Monolithic heterogeneous integration technology has gradually become a research hotspot because of its high integration. The research status and progress of monolithic heterogeneous integration in microsystems are introduced from two aspects. In the field of microelectronic devices, the main development direction is the monolithic heterogeneous integration of group III-V and Si-based CMOS electronic devices. In optoelectronics and MEMS devices, the main development directions are group III-V optoelectronic devices, Si-based CMOS electronic devices And MEMS devices such as monolithic heterogeneous integration. Finally, it summarizes the challenges facing the heterogeneous integration technology and the problems to be solved.