,Effect of the annealing temperature on the long-term thermal stability of Pt/Si/Ta/Ti/4H-SiC contac

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The Pt/Si/Ta/Ti multilayer metal contacts on 4H–SiC are annealed in Ar atmosphere at 600 ?C–1100 ?C by a rapid thermal processor (RTP). The long-term thermal stability is evaluated by aging the annealed contact at 600 ?C in air. The contact’s properties are determined by current–voltage measurement, and the specific contact resistance is calculated based on the transmission line model (TLM). Transmission electron microscope (TEM) and energy-dispersive x-ray spectrometry (EDX) are used to characterize the interface morphology, thickness, and composition. The results reveal that a higher annealing temperature is favorable for the formation of an Ohmic contact with a lower specific contact resistance, and causes the rapid degradation of the Ohmic contact in the aging process.
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