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自制BN/EP(环氧树脂)复合材料和Al2O3/EP复合材料作为LED灯PCB板和散热铝块之间的粘接层材料,采用精密钻孔的方法用高精度测温仪测量LED灯正常工作时的温度分布,讨论粘接层对结温的影响,并与COMSOL Multiphysics软件模拟结果进行对比分析。实验测量LED结温与模拟结温变化趋势基本一致,结温会随着粘接层厚度的增加而上升、随着粘接层复合材料热导率的增加先快速降低而后趋于平缓。最终得到PCB板和散热铝块间最佳粘接层厚度和粘接层复合材料配比,当BN的质量分数为60%时,BN/EP复合材料粘接层的热导率最高,此时LED结温为75.2℃,比纯环氧树脂粘接层LED的结温降低了27.6℃。而Al2O3/EP复合材料粘接层LED的最低结温为78.2℃,此时Al2O3的质量分数为50%。
Homemade BN / EP (epoxy resin) composites and Al2O3 / EP composite materials as the bonding layer between the LED lamp PCB board and the heat-dissipating aluminum block, using the precision drilling method to measure the LED lamp with a high-precision thermometer The temperature distribution during operation was discussed. The effect of bonding layer on junction temperature was also discussed. The results were compared with the COMSOL Multiphysics simulation results. Experimental results show that the junction temperature of LED shows the same trend as that of the simulated junction temperature. The junction temperature increases with the increase of the thickness of the adhesive layer and then decreases rapidly with the increase of the thermal conductivity of the adhesive layer composite and then tends to be gentle. Finally, the optimal thickness of adhesive layer and adhesive layer composite ratio between the PCB board and the heat dissipation aluminum block were obtained. When the mass fraction of BN was 60%, the thermal conductivity of the bonding layer of the BN / EP composite material was the highest, The LED junction temperature is 75.2 ℃, which is 27.6 ℃ lower than the junction temperature of pure epoxy adhesive LED. However, the lowest junction temperature of Al 2 O 3 / EP composite LED was 78.2 ℃, and the mass fraction of Al 2 O 3 was 50%.