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扫描电镜观察表明,在Nb_3Sn层中,柱状Nb_3Sn晶粒几乎占整个Nb_3Sn层厚度的一半。TEM结果示出,靠近青铜基体的粗大的等轴Nb_3Sn晶粒尺寸约为1.5μm,介乎大等轴晶粒和柱状晶层之间的是细小的等轴晶粒层,细晶粒的平均尺度约为0.18μm。在同一细晶层中,晶粒尺寸相差很大,较大晶粒尺寸约为较小晶粒的10倍。较小晶粒群似乎被大晶粒联成的界包围着,位错在晶粒上明显可见。文章也讨论了带材的临界电流特性与显微结构的关系。
Scanning electron microscopy showed that in the Nb 3 Sn layer, the columnar Nb 3 Sn grain almost accounted for half the thickness of the entire Nb 3 Sn layer. The TEM results show that the coarse equiaxed Nb_3Sn grain size near the bronze matrix is about 1.5μm and that between the large equiaxed grains and the columnar grains is a fine equiaxed grain layer with an average of fine grains The scale is about 0.18 μm. In the same fine grain layer, the grain size varies greatly, and the larger grain size is about 10 times larger than the smaller grain. Smaller clusters appear to be surrounded by larger grains and dislocations are clearly visible on the grains. The article also discusses the relationship between the critical current characteristics and the microstructure of the strip.