The electrochemical behaviors of commercially pure titanium(CP Ti) and Co-Cr alloy in Ringer's solution have been investigated.The results indicate that the
Based on phase diagrams and measured activities, the calculating model of mass action concentrations for heterogeneous melts Ag-Au-Cu was formulated. Calculated
Extrusion experiments with different filling contents at the temperature of 440 ℃ were conducted for solution treated 7050 aluminum alloy.The microstructure of
The growth of Au-Sn intermetallic compounds(IMCs) is a major concern to the reliability of solder joints in microelectronic,optoelectronic and micro-electronic-