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基于BCB的薄膜多层基板具有优异的高频特性,是毫米波频段多芯片组件集成封装的重要途径。研究了BCB薄膜多层基板在Ka波段相控阵雷达T/R组件中应用的可行性,首先与LTCC基板对比验证了BCB微带线的传输特性,然后研制了功率分配/合成器、穿墙过渡等关键微波无源电路,最后设计了八通道的无源组件进行微波性能测试评估,结果表明基于BCB的薄膜多层基板能够满足应用需要。
BCB-based thin-film multi-layer substrate with excellent high frequency characteristics of millimeter-wave multi-chip package is an important way to package. The feasibility of applying BCB thin film multilayer substrate to the T-R module of Ka-band phased array radar was studied. The transmission characteristics of the BCB microstrip line were verified by comparison with the LTCC substrate. Then the power distribution / synthesizer, Transition and other key microwave passive circuits, the final design of the eight-channel passive components for microwave performance evaluation, the results show that the BCB-based thin film multilayer substrate to meet the application needs.