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基于柔性印刷电路板(flexible printed circuits board,FPCB)技术,通过在聚酰亚胺基底薄膜表面层压的铜箔上刻蚀微电极阵列结构制备了一种细胞电融合芯片。在低电压(≤40V)条件下实现了细胞电融合,融合效率达37%,远高于聚乙二醇(polyethylene glycol,PEG)法及传统细胞电融合方法。与传统细胞电融合系统相比,此芯片可在低电压条件下工作,具有结构简单、成本低廉、实验过程可观察、融合通量高等优点。另外,聚酰亚胺薄膜基底良好的柔软度可保证此芯片与其它分析模块(如细胞筛选分离模块)的有效集成,具备构造微全分析系统(micro total analytical system,μ-TAS)的巨大潜力。
Based on the flexible printed circuits board (FPCB) technology, a cell electrofusion chip was prepared by etching the microelectrode array structure on the copper foil laminated on the surface of polyimide substrate. The cell electrofusion was achieved at low voltage (≤40V) with a fusion efficiency of 37%, much higher than polyethylene glycol (PEG) and traditional cell electrofusion methods. Compared with the traditional cell electrofusion system, this chip can work under low voltage conditions, with the advantages of simple structure, low cost, observable experiment process and high fusion flux. In addition, the good softness of the polyimide film substrate ensures that this chip can be effectively integrated with other analytical modules such as cell-sorting modules and possesses the great potential of constructing a micro-total analytical system (μ-TAS) .