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介绍了2.5～40Gb/s的光通信收发器处理芯片的研究情况,芯片功能包括复接器、激光驱动器、前置放大器与限幅放大器、时钟恢复和数据判决电路以及分接器。采用的工艺有0.18/0.25μmCMOS,0.15/0.2μmGaAsPHEMT和2μmGaAsHBT等,采用多项目晶圆方式和国外先进的工艺生产线进行芯片制作。研究中采用了高速电路技术和微波集成电路技术,如采用SCFL电路、超动态D触发器电路、同步注入式VCO、分布放大器、共面波导和传输线技术等。在SDH155Mb/s～2.5Gb/s的收发器套片设计方面已实现产品化。还介绍了10Gb/s的收发器套片产品化问题,如封装问题等,讨论了40Gb/s以上速率芯片技术的发展趋势,包括高速器件建模和测试问题等。
The research status of 2.5 ~ 40Gb / s optical communication transceiver chip is introduced. The chip functions include multiplexer, laser driver, preamplifier and limiting amplifier, clock recovery and data decision circuit, and tap. The process used is 0.18 / 0.25μmCMOS, 0.15 / 0.2μmGaAsPHEMT and 2μmGaAsHBT, using multi-project wafer method and foreign advanced production line for chip production. The research used high-speed circuit technology and microwave integrated circuit technology, such as the use of SCFL circuit, ultra-dynamic D flip-flop circuit, synchronous injection VCO, distribution amplifier, coplanar waveguide and transmission line technology. In the SDH155Mb / s ~ 2.5Gb / s transceiver chip design has been achieved product. Also introduces the 10Gb / s transceiver chip product problems, such as packaging issues, discusses the 40Gb / s chip technology trends, including high-speed device modeling and testing issues.