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采用多弧离子镀膜设备制备了掺杂Cu的AlN/TiN-Cu纳米复合多层膜,利用FESEM、HRTEM和XRD分别表征了薄膜的微观结构和相组成,用压入法和划痕法确定了薄膜的硬度和膜/基结合力,研究了Cu对AlN/TiN-Cu复合多层膜微观结构和力学性能的影响。结果表明,Cu的掺杂对薄膜的微观结构有较大的影响。薄膜的平均晶粒尺寸随Cu含量的增加而逐渐减小。掺入少量Cu后,薄膜的硬度均有提高,但不同种类的薄膜有不同的临界载荷变化趋势,纳米复合单层薄膜的临界载荷有所增大,而纳米复合多层膜的临界载荷反而有所减小。
The Cu-doped AlN / TiN-Cu nanocomposite multilayer films were prepared by multi-arc ion plating equipment. The microstructure and phase composition of the films were characterized by FESEM, HRTEM and XRD, respectively. The effects of Cu on the microstructure and mechanical properties of AlN / TiN-Cu composite multilayer films were investigated. The results show that Cu doping has a great influence on the microstructure of the films. The average grain size of the films decreases with the increase of Cu content. After doping a small amount of Cu, the hardness of the films increased, but the different types of films have different critical load trends, the critical load of nanocomposite monolayers increased, but the critical load of nanocomposite multilayer films instead Reduced.