下颌阻生第三磨牙拔除术是牙槽外科一项较为复杂的手术。其术后的主要并发症为拔牙后疼痛、面部肿胀反应、感染、干槽症、拔牙术后出血、颞下颌关节紊乱综合征和开口受限等。半导体激光器发展至今,在诸多领域中都得到了广泛应用。本文通过对激光生物学效应的探讨,对半导体激光在下颌第三磨牙拔除术后并发症预防方面的作用作一综述。 Mandibular third molar extraction surgery is a more complicated alveolar surgery. The main complications after the extraction of pain after the tooth extraction, facial swelling reaction, infection, dry socket, extraction of bleeding after surgery, temporomandibular joint disorder syndrome and limited openings. The development of semiconductor lasers has been widely used in many fields. In this paper, we discuss the role of laser in the prevention of complications after mandibular third molar extraction through the discussion of laser biological effects.