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本文分析了回流焊传热机理,通过铝板回流焊接工艺试验与数值计算确定回流炉各温区炉腔上、下壁喷孔气流速度(Ve);建立回流焊接过程仿真模型,对铝板进行回流焊接仿真,并与工艺试验结果进行对比,验证了模型的合理性。最后,应用建立的模型对实际生产中的PCBA进行焊接仿真,并对PCBA焊点仿真温度曲线进行对比探讨,进一步验证了回流焊过程模型及仿真的合理性,也为PCBA回流焊接温度曲线的设定提供较好的应用参考依据。
In this paper, the heat transfer mechanism of reflow soldering was analyzed. The flow rate (Ve) of the nozzle holes on the upper and lower walls of the furnace cavity was determined by aluminum reflow soldering process and numerical calculation. The reflow soldering process simulation model was established and the aluminum plate was reflow soldered Simulation and experimental results with the process of comparison, verify the rationality of the model. Finally, the established model is used to simulate the welding of PCBA in actual production, and the simulation of PCBA solder joint temperature curve is compared to further verify the rationality of the reflow process model and simulation, but also for PCBA reflow soldering temperature curve set Will provide a better application of reference.