论文部分内容阅读
研究了一种Ag包裹量可控制备Cu@Ag核壳颗粒的方法,其中利用乙二醇(EG)作为还原剂,AgNO3作为Ag源。探讨了不同分散剂,明胶、十六烷基三甲基溴化铵(CTAB)、聚乙烯吡咯烷酮(PVP)对Cu@Ag核壳颗粒形貌的影响,其中明胶作为分散剂时的包覆效果最佳。以明胶作为分散剂,当AgNO3浓度为0.93mol/L时,制得了包裹均匀的Cu@Ag核壳颗粒,其压实薄膜电阻仅为1.6Ω/sq,具有良好的导电性。通过表面Ag的包裹,Cu@Ag核壳颗粒在空气中放置4个月后,压实薄膜电阻为12.6Ω/sq,表现出持久的抗氧化性能。醇还原法可以实现在Cu颗粒表面快捷可控地制备Ag包裹层,包覆率高,且Cu@Ag复合颗粒抗氧化性能持久,适用于工业生产。
A method for preparing Cu @ Ag core-shell particles with controlled amount of Ag coating was studied, in which ethylene glycol (EG) was used as reducing agent and AgNO3 as Ag source. The effects of different dispersants, gelatin, cetyltrimethylammonium bromide (CTAB) and polyvinylpyrrolidone (PVP) on the morphology of Cu @ Ag core-shell particles were investigated. The effect of gelatin on the morphology of Cu @ optimal. Gelatin was used as dispersant. When the concentration of AgNO3 was 0.93mol / L, a uniformly coated Cu @ Ag core-shell particle was obtained. The compacted film resistance was only 1.6Ω / sq, which showed good conductivity. The Cu @ Ag core-shell particles, after being placed in air for 4 months by surface Ag wrapping, had a compacted film resistance of 12.6 Ω / sq, exhibiting long-lasting anti-oxidant properties. The alcohol reduction method can be used to prepare the Ag coating layer on the surface of Cu particles quickly and controllably. The coating rate is high and the oxidation resistance of the Cu @ Ag composite particles is durable. It is suitable for industrial production.