论文部分内容阅读
为了提高电子产品的各项技术指际及其可靠性,必须首先提高焊接工艺水平。而高密度电路的焊接,必须优先采用焊接新工艺以代替传统的手工焊接。为此,我所于1976年底引进瑞士波峰焊接机,随后又订购了成都无线电器厂的片状电阻。 通过半年多的整机调试及对分立元件、片状元件的大量焊接试验,可以认为:用片状元件焊出的产品焊点极牢,其产品体积也比分立元件的小几倍。要想把3.2×1.6mm或22×1.25mm这样小的电阻、电容和管芯焊到印制板上,只能采用波峰焊接机进行焊接,手工焊接是无法解决的。
In order to improve the technical index of electronic products and their reliability, we must first improve the level of welding technology. The high-density circuit welding, welding technology must give priority to replace the traditional manual welding process. To this end, I introduced the Swiss wave soldering machine at the end of 1976, and subsequently ordered the sheet resistance of Chengdu Radio Factory. After more than half a year’s commissioning of the whole machine and a large number of welding tests on discrete components and chip components, it can be considered that the products soldered by the chip components are very strong and their product volume is several times smaller than the discrete components. To 3.2 × 1.6mm or 22 × 1.25mm such a small resistor, capacitor and die soldered to the PCB, the only wave soldering machine welding, manual soldering can not be solved.