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据法国YOLE Developpement公司资料预测,在2004年手机用的MEMS 器件市场规模约为2000万美元,而在未来的三年中,该市场将扩大10倍,到 2008年将达到2.5亿美元的水平。而达到这一市场规模有四个条件:①标准的封装技术,特别是实现芯片级封装(CSP)和圆片级封装(WLP);②实现1.2 mm ×5 mm×5 mm以下的封装尺寸;③实现在150 mm圆片有3500-5700个器件的芯片尺寸;④实现器件在1.5-1.2美元的价格水准。其中低价格因素特别重要,该公司认为MEMS器件必须控制在2美元以下。
According to the French company YOLE Developpement, the market size of MEMS devices for handsets in 2004 is estimated to be about 20 million U.S. dollars. In the next three years, the market will expand 10 times and reach 250 million U.S. dollars in 2008. There are four conditions to achieve this market size: ① Standard packaging technology, especially for chip scale package (CSP) and wafer level package (WLP); ② Package size of 1.2 mm × 5 mm × 5 mm; ③ to achieve in the 150 mm wafer 3500-5700 device chip size; ④ to achieve the device in the 1.5-1.2 US dollars price level. Among them, the low price factor is particularly important. The company believes MEMS devices must be controlled below $ 2.