目前,电子系统的设计流程还是传统模式:在整个设计进程中,不同的工程组(硅芯片、IC 封装和印刷电路板的设计者)在相对隔绝的环境中按部就班地工作。然而,对于当今的高级系统来说,为了确保目标产品在无需付出不必要的开发成本前提下,以尽可能低的生产成本赢得市场的青睐,平行的设计工作势在必行。 At present, the design process of electronic systems is still the traditional one: different engineering groups (silicon chip, IC package and printed circuit board designer) work step by step in a relatively isolated environment throughout the design process. However, with today’s advanced systems, parallel design work is imperative to ensure that the target product wins the market with the lowest possible production cost without sacrificing development costs.