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采用动电位极化、交流阻抗和电容测量等方法,研究了316L不锈钢在不同浓度的NaCl、NaS·9H2O溶液中的电化学行为以及生成钝化膜的半导体性质。试验研究结果表明:①随着NaCl浓度的增加,316L不锈钢点蚀电位及点蚀孔内溶液电阻下降很快,耐点蚀能力下降。随着NaCl浓度增加,316L不锈钢生成半导体钝化膜困难,钝化膜结构由n、p型转化为p型,钝化膜杂质含量增加,耐点蚀能力下降。②随着NaS·9H2O浓度的增加,316L不锈钢点蚀电位以及点蚀孔内溶液电阻下降很快,耐点蚀能力下降。在不同浓度的NaS·9H2O溶液中,316L不锈钢生成的半导体钝化膜均为n、p型,钝化膜杂质含量随着NaS·9H2O浓度的增加而增加,耐点蚀能力下降。
The electrochemical behavior of 316L stainless steel in NaCl and NaS · 9H2O solutions with different concentrations and the semiconducting properties of passivation films were investigated by potentiodynamic polarization, AC impedance and capacitance measurements. The experimental results show that: (1) With the increase of NaCl concentration, the pitting potential of 316L stainless steel and the solution resistance of pitting hole decrease quickly, and the pitting corrosion resistance decreases. With the increase of NaCl concentration, 316L stainless steel is difficult to form semiconductor passivation film, the passivation film structure from n, p type into p type, passivation film impurity content increased, pitting resistance decreased. ② With the increase of NaS · 9H2O concentration, the pitting potential of 316L stainless steel and the solution resistance in pitting hole decreased rapidly, and the pitting corrosion resistance decreased. In different concentrations of NaS · 9H2O solution, 316L stainless steel generated semiconductor passivation films are n, p type, passivation film impurity content increases with the increase of NaS · 9H2O concentration, pitting resistance decreased.