以SIS(苯乙烯-异戊二烯-苯乙烯三嵌段共聚物)作为基体树脂制备HMPSA(热熔压敏胶)。研究了不同类型增塑剂与SIS基体的相容性对压敏胶(PSA)性能及动态流变行为的影响,并探讨了PSA性能与动态流变行为之间的关系。结果表明:当增塑剂与SIS中PS(聚苯乙烯)相的相容性较好时,相应HMPSA在低频(1 Hz)时的储能模量较低,初粘力较好;当增塑剂与SIS中PI(聚异戊二烯)相的相容性较好时,相应HMPSA在高频(100 Hz)时的损耗模量较高,剥离强度较大。 HMPSA (hot melt pressure-sensitive adhesive) was prepared using SIS (styrene-isoprene-styrene triblock copolymer) as a base resin. The influence of compatibility of different types of plasticizers and SIS matrix on PSA properties and dynamic rheological behavior was investigated. The relationship between PSA properties and dynamic rheological behavior was also discussed. The results show that when the plasticizer has good compatibility with PS (polystyrene) phase in SIS, the corresponding storage modulus of HMPSA is lower at low frequency (1 Hz) When the plasticizer has good compatibility with PI (polyisoprene) phase in SIS, the corresponding HMPSA has higher loss modulus at high frequency (100 Hz) and greater peel strength.