论文部分内容阅读
以手机为代表的数字信息家电已成为牵引 CSP(芯片尺寸封装)普及的主要动力,目前这一领域的发展以日本较为活跃和得意。随着科技进步以及市场发展,CSP 的应用范围日益广泛。为适应发展并加速推广应用,当前仍有许多组装技术难题急需解决,有关研发机构都力求获得更多的关键技术专利。当前世界各主要国家和地区在组装技术研发的重点领域呈现如下发展格局和态势。在窄管脚间矩方面:日本的夏浦、东芝、ASET,美国的 TI、Trusi 等公司正开展芯片级3D 研发;欧洲的 3D-Plus 正开展3D 封装研发。美国的 LrVine-Sensors 正开展 WL-3D研发。美国的摩托罗拉正开展区域阵列型 CSP
Digital information appliances represented by mobile phones have become the main driving force for traction CSP (chip size package), and the current development in this area is more active and proud in Japan. With the progress of science and technology and the development of the market, CSP has a wide range of applications. In order to adapt to the development and accelerate the popularization and application, there are still many assembly technology problems that need to be solved urgently. The R & D institutions all strive to obtain more key technology patents. At present, all major countries and regions in the world present the following development pattern and trend in the key areas of assembly technology research and development. In the narrow pinnacle: Japan’s Xiapu, Toshiba, ASET, the United States TI, Trusi and other companies are developing chip-level 3D R & D; Europe’s 3D-Plus is 3D packaging research and development. LrVine-Sensors of USA is developing WL-3D. Motorola is conducting regional array CSPs in the United States