采用动态热力学分析方法(DMA),研究了联苯液晶聚氨酯(DLCP)/环氧树脂(E-51)固化体系的储能模量、损耗模量和力学损耗因子随温度的变化情况。在玻璃化转变温度(Tg)下,通过改变振动频率求出链段运动的活化能并探讨聚合物分子链段的运动情况。结果表明:DLCP可降低材料的内耗,提高材料的Tg。加入质量分数5%的DLCP,复合材料的储能模量可达2 700 MPa,Tg比纯树脂提高10～30℃。 The changes of storage modulus, loss modulus and mechanical loss factor with temperature for the curing system of biphenyl liquid crystal polyurethane (DLCP) / epoxy resin (E-51) were studied by dynamic thermodynamic analysis (DMA). At the glass transition temperature (Tg), the activation energy of the segment motion was determined by changing the vibration frequency and the movement of the polymer molecule segment was discussed. The results show that DLCP can reduce the material internal friction and increase the Tg of the material. Adding 5% DLCP, the composite has a storage modulus of 2 700 MPa and a Tg of 10-30 ° C higher than pure resin.