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综合2,5-二氨苯基嘧啶(PRM)的刚性结构特征和配位化学特征以及二苯醚二胺(ODA)的柔性结构特征,制备出一系列性能可控的含嘧啶聚酰亚胺.含嘧啶聚酰亚胺的玻璃化转变温度、热稳定性、拉伸强度和模量等,均随聚酰亚胺中PRM比例的升高而增加.但热膨胀系数却随PRM比例的增加而降低,当PRM和ODA的比例为1∶1时,热膨胀系数为17×10-6K-1,与铜箔的热膨胀系数一致,可与铜箔形成尺寸稳定的无胶挠性覆铜板;同时,这一比例的含嘧啶聚酰亚胺与铜箔的粘结强度也达到最高(17.3 N·cm-1).这种含嘧啶聚酰亚胺的性能可以满足无胶挠性印制电路对基底膜材料的尺寸稳定性和粘结性能的要求.
Based on the rigid structure and coordination chemistry of 2,5-diaminophenylpyrimidine (PRM) and the flexible structure of diphenyletherdiamine (ODA), a series of pyrimidine-containing polyimides The glass transition temperature, thermal stability, tensile strength and modulus of polyimide containing pyrimidine all increase with the increase of PRM in polyimide, but the thermal expansion coefficient increases with the increase of PRM When the ratio of PRM and ODA is 1: 1, the coefficient of thermal expansion is 17 × 10-6K-1, which is consistent with the thermal expansion coefficient of copper foil and can form a dimensionless and stable non-plastic flexible copper clad laminate with copper foil. Meanwhile, This ratio of pyrimidine-containing polyimide and copper foil also reached the highest bond strength (17.3 N · cm-1). This pyrimidine-containing polyimide performance can meet the non-gel flexible printed circuit on the substrate Film material dimensional stability and bonding performance requirements.