研究了经冷轧复合的Cu/Al复合带在热压温度为500℃、实际压下率为0%~35%变形条件下的铜铝界面扩散反应。结果表明,在此界面扩散反应的过程中,存在晶界扩散机制。Cu/Al复合界面扩散反应生成相次序受相变热力学和扩散动力学两方面因素共同控制,不但与各相生成吉布斯自由能有关,而且遵守通量-能量原则。虽然增加压下率对界面扩散层的生长起到一定的促进作用,但温度仍然是其主要影响因素。 The Cu / Al interface diffusion reaction of cold-rolled composite Cu / Al composite strip under the conditions of hot pressing temperature of 500 ℃ and actual rolling reduction of 0% ~ 35% was studied. The results show that there exists grain boundary diffusion mechanism during the interfacial diffusion reaction. The order of the facies of Cu / Al composite interface diffusion reaction is controlled by both the phase transition thermodynamics and the diffusion kinetics, which are not only related to the Gibbs free energy of each phase but also to the flux-energy principle. Although increasing the reduction rate can promote the growth of interface diffusion layer, the temperature is still the main factor.