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用磁控共溅射法制备Cu-W合金薄膜,运用EDX,XRD,TEM,SEM和纳米压痕仪对薄膜成分、结构和力学性能及其关系进行了研究。结果表明,含W较低的Cu82.1W17.9(%,原子分数)和W浓度较高的Cu39.8W60.2薄膜为晶态结构且出现固溶度扩展,分别存在fccCu(W)亚稳过饱和固溶体(固溶度4.8%W)和bccW(Cu)亚稳过饱和固溶体(固溶度5.7%Cu),W含量为31.8%,45.7%,54.8%的Cu-W薄膜呈非晶态,表面粗糙度较晶态Cu-W薄膜低。总体上非晶Cu-W薄膜弹性模量E和硬度H值较低,fccCu-W膜实测E值介于Voigt和Reuss规则预测值之间,bcc和非晶Cu-W膜实测E值分别高于和低于预测值;晶态Cu-W膜实测H值与Voigt规则计算值的符合性优于非晶膜,薄膜结构对力学性能预测可靠性影响较大。
The Cu-W alloy films were prepared by magnetron sputtering. The composition, structure, mechanical properties and their relationship of the films were investigated by EDX, XRD, TEM, SEM and nanoindentation. The results show that Cu82.1W17.9 (%, atomic fraction) and higher Cu concentration of W39.8W60.2 thin film with W content are crystalline structure and show the expansion of solid solubility, respectively fccCu (W) metastable The Cu-W films with supersaturated solid solution (4.8% W) and bccW (Cu) metastable supersaturated solid solution (5.7% Cu) exhibited amorphous state with Cu contents of 31.8%, 45.7% and 54.8% , The surface roughness is lower than crystalline Cu-W film. In general, the elastic modulus E and hardness H of amorphous Cu-W thin films are low, the measured E value of fccCu-W film is between the predicted Voigt and Reuss rules, and the measured E values of bcc and amorphous Cu-W films are respectively high At and below the predicted value, the coincidence between the measured H value of crystalline Cu-W film and the calculated value of Voigt rule is better than that of amorphous film, and the film structure has a great influence on the prediction reliability of mechanical properties.