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基于三维电磁场仿真软件HFSS和类似于准光学天线的集总源法 ,对一 6 6 0GHz超导混频器的嵌入阻抗在整个 6 0 0 72 0GHz的工作频带范围内进行了详细的分析研究 .同时 ,还系统地分析计算了SIS结芯片的馈点偏移(包括水平偏移和垂直偏移 )及芯片厚度和背向短路器长度变化所产生的影响 .分析结果表明 ,该混频器的嵌入阻抗为 35Ω左右 ,而且在整个工作频带内变化缓慢 ,能够实现宽频带匹配 .SIS结芯片馈点的位置对嵌入阻抗没有太大的影响 ,但芯片厚度的影响非常明显 .这些结果对超导SIS混频器的研制有很好的指导意义 .
Based on the three-dimensional electromagnetic field simulation software HFSS and the lumped source method similar to the quasi-optical antenna, the embedded impedance of a 6 600 GHz superconducting mixer is analyzed and studied in detail over the operating frequency range of 60000 Hz. At the same time, the influences of feed-point offset (including horizontal offset and vertical offset) and chip thickness and back-to-short circuit length of SIS junction chip are systematically analyzed and analyzed.The analysis results show that the The embedded impedance is about 35Ω, and changes slowly in the whole working frequency band, which can achieve broadband matching.The position of the feed point of the ISJ junction chip has no significant influence on the embedded impedance, but the effect of the chip thickness is very obvious. SIS mixer development has a good guiding significance.