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基于Taguchi试验设计,采用L_(16)(4~5)正交表进行试验设计,对液晶聚合物(LCP)微连接器的注塑成型过程进行数值模拟分析,研究工艺参数对制品翘曲变形的影响规律。结果表明:熔体温度对翘曲变形的影响作用较大,温度越高翘曲变形越小,属于显著性影响因素;保压时间对翘曲变形影响最小,属于非显著性因素。
Based on the Taguchi experimental design, the experimental design of the L_ (16) (4 ~ 5) orthogonal test was used to simulate the injection molding process of the LCP connector. The effects of process parameters on the warpage of the product Affect the law. The results show that the influence of melt temperature on warpage is larger, and the warmer deformation is smaller when the temperature is higher, which is a significant factor. The dwell time has the least effect on warpage, which belongs to the non-significant factor.