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据《中国电子报》2004年8月27日报道,半导体硅圆片尺寸的发展早已从小尺寸(2英寸、3英寸、4英寸)、经过中尺寸(5英寸、6英寸)发展到大尺寸(8英寸、12英寸)。目前世界上主流芯片加工线为8英寸,而正处于大力发展12英寸线的阶段。而在我国国内,随着今年7月9日中纬积体电路(宁波)有限公司的6英寸线投产之后,已有6条6英寸线。其中,上海新进为双极型工艺,其余5条均为CMOS工艺。而5英寸线已投产的有7条:
According to China Electronics News reported on August 27, 2004, the development of semiconductor silicon wafer size has been from the small size (2 inches, 3 inches, 4 inches), through the medium size (5 inches, 6 inches) to large size 8 inches, 12 inches). Currently the mainstream chip processing line in the world is 8 inches, and it is in the stage of vigorously developing a 12-inch line. In our country, with 6 mid-latitude integrated circuit (Ningbo) Co., Ltd. 6-inch line on July 9 this year after the commissioning, there are six 6-inch line. Among them, the new Shanghai bipolar technology, the remaining five are CMOS technology. The 5-inch line has been put into operation for seven: