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为改善亚乙基降冰片烯(ENB)自修复微胶囊在环氧树脂(Epoxy)中的分散性,采用KH560偶联剂对ENB微胶囊表面进行处理,探讨KH560改性ENB微胶囊(KH560-ENB)在Epoxy材料中的分散性及KH560-ENB环氧树脂材料(KH560-ENB/Epoxy)的拉伸性能。结果表明:对未改性的ENB微胶囊树脂复合材料(ENB/Epoxy),当ENB微胶囊与Epoxy质量比小于或等于5%时,ENB/Epoxy的拉伸断裂强度、拉伸模量以及断裂伸长率均随ENB微胶囊与Epoxy质量比的增加而降低,但经不同温度预固化后,ENB/Epoxy复合材料拉伸指标初始下降速率均不同;KH560-ENB微胶囊在Epoxy中累积分布线性拟合相关系数为0.9945,接近于1,说明KH560-ENB微胶囊在Epoxy中分散性好,且KH560-ENB/Epoxy复合材料的拉伸断裂强度提高19.1%,拉伸模量提高6.6%;对KH560-ENB/Epoxy复合材料的SEM断面观察结果表明,KH560-ENB微胶囊与Epoxy界面粘接良好。
In order to improve the dispersibility of ENB self-repairing microcapsules in Epoxy, the surface of ENB microcapsules was treated with KH560 coupling agent to investigate the effect of KH560 modified ENB microcapsules (KH560- ENB) in Epoxy and the tensile properties of KH560-ENB epoxy resin (KH560-ENB / Epoxy). The results show that for ENB / Epoxy resin, the tensile strength, tensile modulus and elongation at break of ENB / Epoxy are lower when the mass ratio of ENB microcapsules to Epoxy is less than or equal to 5% The elongation rates of ENB / Epoxy composites decreased with the increase of mass ratio of ENB microcapsules to Epoxy, but the initial descending rates of tensile index of ENB / Epoxy composites were different after pre-curing at different temperatures. The cumulative distribution of KH560-ENB microcapsules in Epoxy The fitting correlation coefficient was 0.9945, which was close to 1, indicating good dispersibility of KH560-ENB microcapsules in Epoxy. The tensile breaking strength of KH560-ENB / Epoxy composites increased by 19.1% and tensile modulus increased by 6.6% SEM observation of KH560-ENB / Epoxy composites showed that the KH560-ENB microcapsules adhered well to the Epoxy interface.