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LED要实现大规模应用必须解决可靠性问题,温度和湿度是影响LED可靠性的两个关键因素。文章对某公司的LED模块进行了显微解剖,依据相关数据对其进行了热湿方面的仿真分析,得到了该模块的热、湿扩散情况、热应力及湿应力分布情况。结果表明:温度场在短时间内达到平衡,而湿度场的平衡时间则长达几十天;湿应力大小为103Pa,热应力大小为108Pa,即LED使用过程中的湿应力远远小于热应力。该结论为进一步研究热湿耦合对LED器件的影响提供了基础,同时为LED模块的封装可靠性设计提供了依据。
LED to achieve large-scale application must solve the reliability problem, temperature and humidity are two key factors that affect the reliability of LED. In this paper, the microscopic anatomy of a company’s LED module was carried out. According to the relevant data, it was simulated in terms of heat and moisture. The thermal and wet diffusion, thermal stress and wet stress distribution of the module were obtained. The results show that the temperature field balances in a short period of time and the equilibrium time of humidity field is several tens days. The wet stress is 103Pa and the thermal stress is 108Pa, which means the wet stress of LED is far less than the thermal stress . This conclusion provides a basis for further study on the influence of heat and moisture coupling on the LED devices, and at the same time, provides the basis for designing the package reliability of the LED module.