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皇家飞利浦电子集团推出采用无引线四方扁平技术的新一代小型分立无线封装。该新型SOT88X封装系列是小体积应用设计师的最佳选择,可减少系统PCB面积和高度,同时在真正大批量生产的封装中增加“分立”功能。
Royal Philips Electronics Group introduced a new generation of small discrete wireless package with lead-free quad flat technology. This new SOT88X package family is the perfect fit for small form factor designers, reducing system PCB area and height while adding “discrete” capabilities to truly mass-produced packages.