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光电互联技术是解决电子设备向高频率、高速度、高集成发展瓶颈的关键技术,而组装工艺技术在光电互联中处于重要地位。针对光电互联要求高精度定位、高兼容性的特点,在分析光电互联技术原理的基础上,从新的角度提出光电互联的组装工艺难题,提出组装工艺解决方案,设计关键组装工艺流程。分析表明,通过控制组装工艺关键技术参数,设计合理的组装工艺流程,能够解决所提出的新组装工艺难题,满足基于光波导的光电互联技术的组装要求。
Photointerconnecting technology is the key technology to solve the bottleneck of high frequency, high speed and high integration of electronic equipment, and the assembly process technology is in an important position in the optical interconnection. According to the requirements of high precision and high compatibility of optoelectronic interconnection, based on the analysis of the principle of optoelectronic interconnection technology, the assembly process of optoelectronic interconnection is put forward from a new perspective. The solutions of assembly process are proposed and the key assembly processes are designed. The analysis shows that by controlling the key technical parameters of the assembly process and designing a reasonable assembly process, the proposed assembly process can be solved and the assembly requirements of the optical interconnection technology based on optical waveguides can be met.