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本文采用DSC、TGA和DDV等热分析手段对聚合物基摩阻材料进行了分析研究。求得了基体的分解活化能,并用实验讨论了S.K.Rhee磨耗与分解活化能的关系式。根据盖斯的热量加合定律得到固化过程的第一、第二阶段的热焓值。另外,还讨论了不同温度下的损耗角正切、模量及玻璃化温度。
In this paper, DSC, TGA and DDV thermal analysis methods such as polymer-based friction materials were analyzed. The decomposition activation energy of the matrix was obtained and S was discussed experimentally. K. Relationship between Rhee wear and decomposition activation energy. The enthalpy of the first and second phases of the curing process is obtained according to Gass’s Law of Heat Addition. In addition, the loss tangent, modulus and glass transition temperature at different temperatures are also discussed.