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据《科技报》日前报导,我国第一颗拥有自主知识产权的第三代手机(3G)芯片在上海研制成功,并在今年内可实现产业化。据悉,这一项目前已列入信息产业部和科技部3G产业基金项目。该芯片是由落户张江高科技园区的留学生企业展讯通信公司研制的,采用0.18微米的数字/模拟混合信号工艺,将数字基带功能、模拟基带功能和电源管理功能集成于一颗基带芯片中,实现了“单芯片”的概念。据报导,国外跨国公司生产的手机芯片,模拟基带、数字处理和电源管理三项功能分散于三颗芯片。很显然,与国外手机芯片相比,展讯公司
According to “Science and Technology Newspaper” recently reported, China’s first third-generation mobile phone (3G) chip with independent intellectual property rights was successfully developed in Shanghai and industrialized within this year. It is reported that this one has been included in the Ministry of Information Industry and Ministry of Science and Technology 3G Industry Fund projects. The chip is set up by the Zhangjiang Hi-Tech Park, a foreign student company Spreadtrum communications company developed using 0.18 micron digital / analog mixed signal technology, digital baseband functions, analog baseband functions and power management functions integrated in a baseband chip, to achieve The concept of “single-chip”. According to the report, mobile phone chips, analog basebands, digital processing and power management features produced by foreign multinational companies are scattered in three chips. Obviously, compared with foreign mobile phone chips, Spreadtrum company